Prototype, small, and medium-sized orders

Large volume orders

Max Layer

12

8

Min. board thickness
(mm)

0.05

0.06

Min. board thickness (base)
(mm)

0.025

0.03

Min. line width/space
(μm)

35/35

50/50

Min. mechanical hole zize
(mm)

0.1

0.12

Max. aspect ratio
(mechanical)

6:1

5:1

Min. laser aperture
(μm)

50

100

Max. aspect ratio
(laser)

0.8:1

1:1

Coverlay alignment accuracy

±0.075

±0.1

Min. solder dam
(μm)

75

Solder mask alignment
(μm)

±35

±50

Stiffener fitting accuracy
(mm)

±0.075

±0.1

Min. BGA center distance
(μm)

0.35

Min SMT pad pitch
(mm)

0.15

0.2