Prototype, small, and medium-sized orders

Large volume orders

Max layers

16

14

Finished board thickness
(mm)

Min 0.25, Max 2.8

Min 0.3, Max 2.4

Dielectric layer thickness
(mm)

25 (1017pp)

28 (1017pp)

Steps

7

5

Metal-based board

FR4, BT, high speed (low loss, ultra low loss)

Base copper thickness

Inner layer

Min 0.33OZ, Max 4OZ

Min HOZ, Max 3OZ

Outer layer

Min. Borehole diameter

Blind via
(mm)

0.06

0.075

Buried via (mm)

0.1

0.15

Through hole
(mm)

0.1

0.15

Hole diameter tolerence

PTH
(mm)

±0.035

±0.05

NPTH
(mm)

±0.03

±0.05

Max. plating hold aspect ratio
(through-hole)

10:1

8:1

Max. plating hold aspect ratio
(laser)

1:1

0.8:1

Width of Gold-finger
(mm)

0.1

0.13

Spacing of Gold-finger
(mm)

0.1

0.1

Half of Gold-finger
(mm)

0.5

0.6

Warping degree

≤0.5%

≤0.75%

CNC routing tolerance
(mm)

±0.05

±0.1

S/M dam
(mm)

0.065

0.075