Prototype, small, and medium-sized orders

Large volume orders

Max layers

24

14

Max size

500*700

Max. board thickness
(mm)

3

2.5

Min. board thickness (base) (mm)

0.025

0.03

Min. line width/space
(inner-layer) (μm)

35/35

50/50

Min. line width/space
(outer-layer) (μm)

45/45

55/60

Min. mechanical hole zize
(mm)

0.1

0.12

Max. aspect ratio
(mechanical)

6:01

5:01

Min. laser aperture
(μm)

50

100

Max. aspect ratio
(laser)

1:1

0.8:1

Min. BGA central distance
(mm)

0.35

Min. SMT pad pitch (mm)

0.15

0.2

Min. solder dam
(μm)

75

100

Solder mask alignment
(μm)

±35

±50

HDI rigid-flex board (HDI structure)

7

5

Impedance contral tolerance

±7%

±10%