Prototype, small, and medium-sized orders

Large volume orders

Max layers

8

6

Finished board thickness
(mm)

Min 0.13
Max 2.8

Min 0.16
Max 2.4

Dielectric layer thickness
(mm)

25 (1017pp)

28 (1017pp)

Metal-based board

FR4, BT, high speed (low loss, ultra low loss)

Base copper thickness

Inner layer

Min 0.33OZ,
Max 1.5OZ

Min HOZ,
Max 1.5OZ

Outer layer

Min. Borehole diameter

Blind via
(mm)

0.06

0.075

Buried via (mm)

0.075

0.1

Through hole
(mm)

0.075

0.1

Hole diameter tolerence

PTH
(mm)

±0.035

±0.05

NPTH
(mm)

±0.03

±0.05

Max. plating hold aspect ratio
(through-hole)

10:1

8:1

Max. plating hold aspect ratio
(laser)

1:1

0.8:1

Width of Gold-finger
(mm)

Min 0.035

Min 0.04

Spacing of Gold-finger
(mm)

Min 0.02

Min 0.02

Warping degree

≤0.5%

≤0.1%

CNC routing tolerance
(mm)

±0.075

±0.1

S/M dam
(mm)

0.065

0.075

Min. diameter of resistance welding plug hole
(mm)

0.075

0.1

Thickness diameter ratio of resistance welding plug hole

6:1

4:1